DELO Develops Flexible Electronics Adhesive

German based company DELO has developed a flexible electronics adhesive to permanently seal sensor housing. DELO DUALBOND BS3770 protects components, such as image sensors, in an airtight seal, it also meets stringent requirements for the semiconductor and automotive industries.
 
Strict safety requirements of autonomous driving image sensors and other reliable components are to be installed in LiDAR and RADAR systems. According to standard ACE-Q100, current hermetic sealing for housing and filter glass are failing to withstand the tests of the automotive industry. 
 
DELO’s DUALBOND BS3770 is a special electronics adhesive that meets the reliably and qualifications tests that semiconductor manufacturers must meet for automotive suppliers. 
 
The adhesive can be applied precisely via needle dispensing while maintaining narrow and high bondlines. The curing process consists of UV light and heat; post dispensing, DUALBOND BS3770 is fixed by classic light fixation for a few seconds. 
 
Alternatively, DUALBOND BS3770 can be transferred to the B-stage where it achieves an initial adhesion comparable to tape, then the second component can be joined. The component is directly fixed so that it can be entirely processed. Final curing occurs in a convection oven at +150 degrees Celsius in 40 minutes. 
 
Unlike other adhesives on the market, this product is flexible with a Young’s modulus of less than 5 MPa at room temperature. The adhesive can compensate for pressure changes, humidity differences or hat input on the reflow process during production, which deters against pop-ups or delamination. 
 
DELO DUALBOND BS3770 has uses in image sensors for LiDAR and RADAR applications, and in driver monitoring and 5G applications. DELO will be presenting at SEMICON Europe in Munich, Germany from November 14-17, 2023.